Taiwanese materials distributor Hwa Lie Enterprise has secured a NT$6 billion syndicated loan backed by eight banks, good news for the company and for Taiwan's AI supply chain.

• Hua Nan Bank, E.Sun, Land Bank, Mega and First Bank served as joint lead arrangers, with Bank of Taiwan, SinoPac and Taiwan Business Bank also participating in the lending.
• The funds will go toward global expansion of its high-tech materials and equipment businesses in semiconductors, PCBs, optical communications and ICT.
• With demand from AI and high-performance computing continuing to provide a lift, Hwa Lie's operations and profits have repeatedly hit record highs in recent years.
• As server cooling shifts from air cooling to liquid cooling, Hwa Lie has moved into high-end adhesive materials for liquid cooling and has introduced assembly automation solutions for NVIDIA's next-generation computing platform.
• On the PCB side, it supplies high-end copper clad laminates on a stable basis, helping customers break into the supply chain for next-generation AI server motherboards at US cloud providers.

Outlook: With this financing in hand, Hwa Lie is expected to accelerate its push into advanced packaging, liquid cooling and high-speed transmission materials, and its revenue momentum looks set to continue.