Taiwan's Solomon is pushing deeper into chip inspection, a positive sign for its business as AI chip packaging demand grows.

• Solomon unveiled a system that checks whole wafers for warping while they still sit inside their carrier boxes, using light-based sensors instead of touching them.
• Catching a bent or tilted wafer before a robot arm picks it up cuts the risk of cracks, collisions, contamination, and factory downtime.
• A second tool uses AI vision to spot bad holes in glass — missing holes or wrong-sized ones — aimed at the advanced packaging used for AI chips.
• Solomon is also sending robots with cameras and arms around chip plants to read gauges and lights and flag broken equipment on their own.
• The company says the gear drops into existing plants without rewiring the factory or stopping production.

Outlook: With AI chip packaging driving demand for tighter quality control, Solomon is positioning to sell more inspection gear to chipmakers over the coming year.