SEMICON Taiwan 2026 opens: GlobalWafers sees silicon wafer boom, TSMC expands 3D IC alliance

Sep 01, 2026

Taiwan's chip industry is signalling two strong years ahead, driven by AI demand — good news for wafer makers, chip designers, and investors in the semiconductor supply chain.

  • GlobalWafers expects double-digit growth in silicon wafers over the next two years, with both shipments and prices rising as customers build new plants.
  • AI is causing a structural shift in demand, not just a normal upswing.
  • TSMC has brought system integrators into its 3D IC alliance for the first time, because chips can no longer be tested in isolation from the systems they run in.
  • Advanced technology is moving too fast for step-by-step development, so the industry is being pushed toward parallel development and closer system-chip co-design.
  • In Europe, TSMC says demand for advanced chips is growing but still too small to justify a plant, so it is training European design teams to help create that demand.

Outlook: Expect wafer prices and volumes to keep climbing as AI buildouts continue, while Europe stays a slow-burn project for TSMC.

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