Taiwan chip equipment maker Chun Hwa says orders for advanced packaging gear are piling up faster than it can build them — good news for the company and a sign the AI chip boom is still accelerating.

• Orders are already booked out to the third quarter of next year, and they keep coming in.
• Demand for die bonders is growing so fast they will pass chip sorters as the bigger revenue source this half.
• AI chips are now so valuable that a bonding mistake is very costly, so customers pay far more for precision machines — foreign gear can cost five to ten times more per unit.
• The whole market for these bonding machines has jumped from a few hundred million dollars globally to potentially many times that, just for advanced packaging.
• Capacity is the bottleneck: most machines are built by parent company Gallant Precision, and the supply gap is still wider than expected.

Outlook: The next six to seven months should bring peak revenue from its largest customers, with the shortage of advanced packaging equipment unlikely to ease soon.