Taiwan's chip packaging suppliers are running flat out, a good sign for the AI hardware chain and for investors watching the sector.

• Wanrun's factories are running near full tilt, with orders already booked into the middle of next year.
• Gudeng is also at full capacity and expects the second half of the year to beat the first.
• Demand is coming from EUV mask boxes and wafer carriers, as chipmakers keep building new plants.
• Gudeng's advanced packaging carriers have tripled in sales from last year and start shipping in small volumes now, with test results beating what customers expected.
• Wanrun is moving into silicon photonics gear, a field being built from scratch, and Gudeng is finishing an Arizona parts plant to serve US aerospace and chip customers.

Outlook: Both companies expect fast growth over the next two years as advanced packaging and EUV demand keep climbing.