Taiwanese packaging and testing house Powertech Technology Inc. (PTI) has a full order book for advanced packaging, sending its share price sharply higher and drawing in institutional investors — good news for shareholders and for the AI supply chain as a whole.

• PTI shares jumped more than 4% yesterday on heavier trading volume, with foreign investors and proprietary dealers together buying a net 3,600-plus lots.
• Chairman Tsai Tu-kung said fan-out panel-level packaging (FOPLP) capacity has already been fully booked by AMD and Broadcom.
• Longer equipment lead times have pushed new capacity originally due this year back to the middle of next year, with a further expansion in 2028.
• PiFO, a technology similar to TSMC's CoWoS, enters mass production in the middle of next year; optical engine components will ship in small volumes by the end of this year, and CPO switches go into mass production in 2027.

Outlook: With capacity full and AI customers queuing up to place orders, PTI's growth momentum over the next two years is clear, though the pace of near-term expansion is constrained by equipment lead times.