Gudeng Running at Full Capacity; Advanced Packaging Shipments Set for Rapid Growth Over the Next Two Years

Aug 27, 2026

Strong orders and full capacity utilization at semiconductor carrier maker Gudeng are good news for shareholders and for the semiconductor supply chain.

  • Shipments of EUV reticle pods and FOUP wafer carriers are robust, capacity is fully utilized, and second-half revenue is expected to exceed that of the first half.
  • Revenue for the first seven months of this year rose nearly 30% year on year, with demand driven by continued capacity expansion among customers.
  • Advanced packaging carriers began shipping in small volumes in the second half, with sales already triple last year's level, and validation results exceeding customer expectations.
  • Validation of a composite product in South Korea has entered its final stage, with small-volume shipments possible as early as next quarter.
  • The aerospace business has grown 60% over two years, and a new plant in Arizona in the United States is nearing completion, with trial production slated for the fourth quarter.

Outlook: With advanced packaging and aerospace both ramping up as new business lines, growth momentum over the next two years is expected to be stronger than this year.

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