Taiwan chip packager Powertech says AMD and Broadcom have taken all of its new panel-level advanced packaging capacity — good news for Powertech, and another sign that AI chip demand is running far ahead of supply.

• Powertech's FOPLP capacity is sold out to AMD and Broadcom, with mass production starting mid-next-year.
• The ramp is slower than planned because equipment deliveries are running late — the extra capacity added this year is pushed out, with a bigger expansion in 2028.
• AI chips are getting bigger and more tightly packed, so packaging is now a bottleneck; Powertech says its panel yields are above 90%.
• Optical parts for customers ship in small volumes by year-end, and co-packaged optics switches are targeted for 2027.
• The AUO plant Powertech bought will become a second base for advanced packaging work.

Outlook: Advanced packaging stays tight into next year, and equipment delays — not demand — are what limit how fast Powertech can grow.