Shares of Taiwanese IC packaging and testing firm Chipbond surged to their daily limit up today, welcome news for investors holding the stock, driven by demand for advanced packaging.

• Chipbond's shares opened higher and climbed further, hitting the limit up during the session, with buy orders queuing up to get in.
• Foreign investors and proprietary dealers were net buyers for a second consecutive day, while investment trusts sold modestly; the three major institutional investors were still substantial net buyers overall.
• The company is shifting from traditional panel driver ICs toward new applications such as silicon photonics, LPO, RF and RFID.
• It raised packaging and testing quotes across the board in the second quarter, directly lifting its profit margins.

Outlook: Institutional investors expect operations in the second half to outperform the first half, with the advanced packaging theme likely to continue driving the share price.